TE Connectivity 1747216-9 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: Intel?® Pentium?® 4 (mPGA479 pattern) Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Contact Style: Stamped + Formed Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 26x26 Grid Spacing (mm [in]): 1.27 x 1.27 [.050 x .050] Heat Sink Attachment: With Heat Sink Style: Two Center Latches Housing Color: Black Housing Material: High Temperature Thermoplastic Housing Material Temperature: High Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245?°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 479 Packaging Method: Tape Mounted on Reel Packaging Quantity: 200 sockets/box Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: None Socket Overall Height (mm [in]): 3.1 [0.122] Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver Other Names: 1747216-9